Power Electronics Forum
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Power Electronics Forum
This year, electronica was held purely virtually from November 9 to 12. Aspencore, one of the major media partners of electronica, was organizing the virtual Power Electronics Forum and the virtual Embedded Forum. The 4-days conference program of the forums, which was followed by more than 1,200 visitors, is now available on demand.
The Power Electronics Forum at electronica virtual provides technical papers about innovative applications and technologies, trends and new product offerings covering the whole range of Power Electronics Components, Power Supplies and Batteries.
The Power Electronics Forum focuses on following topics:
Power Semiconductors & Components
(PC1) Keynote: Power devices market evolution and related technical developments
Ana Villamor, Technology & Market Analyst, Power Electronics at Yole Développement and Elena Barbarini, Director, Semiconductor Devices Department at System Plus Consulting
The global power electronics market is worth $17.5B, with a 4.3% Compound Annual Growth Rate (CAGR) from 2019-2025, mainly pushed by automatization, efficiency regulations and clean energy goals. Within this market, we can differentiate three different major drivers: silicon MOSFETs, IGBT modules and Wide Band Gap (WBG) devices. The WBG market is driven by SiC MOSFET module adoption in EV/HEVs, such as Tesla and BYD. Technology-wise, there are still developments at die level for all these components and there is a trend for more performant modules with advanced materials and packaging. During the presentation, we will go over the highlights of the market evolution and will show real examples of actual technologies used by the main manufacturers, for both Silicon and WBG.
(PC2) Next generation HV power GaN technology and the benefits of copper-clip SMD packaging (CCPAK)
Dr. Dilder Chowdhury, Strategic Marketing Director at Nexperia
Addressing the many design challenges todays engineers face with high performance, high power and high frequency designs, in this session we look at Nexperia’s next-generation HV power GaN FET technology. Including the innovative CCPAK package, a low parasitic, high-performance power package designed with all copper-clip technology, also providing enhanced reliability and ease of SMD manufacturing.
(PC3) CMOS Isolators, the Heroes of Vehicle Electrification
Rudye McGlothlin, Direct of Marketing of Power Products, Silicon Labs
The movement towards more electrification of the automobile is accelerating. Electric vehicles (EV’s) have moved from niche to mainstream seemingly faster than an Indy 500 lap. Although, EV’s rightfully hold a position of cutting-edge technology in the automotive market space, some of the key components that make up critical systems could be considered foundational. The galvanic isolator, in its modern CMOS form, allows for communication between low-voltage and high-voltage systems. Considering that EV’s are moving towards 800 V systems, the need for isolation is imperative. In this session we’ll discuss the important features of CMOS based isolation that have enabled the success of the electrification trend.
(PC4) Cutting-edge SiGe Rectifiers: enhancing safe operating area for high temperature, high frequency applications
Dr. Reza Behtash, Application Marketing Manager at Nexperia
Discrete rectifiers in power electronics are decisive components that affect the efficiency, reliability, and the dimensions of important units like the "on board charger" in EV cars. In the recent years silicon carbide (SiC) Schottky diodes has been established as state-of-the-art rectifier technology in power electronics. However, SiC rectifiers are usually used at 650V and beyond and they come with a premium price compared to silicon-based solutions. Nevertheless, there are numerous power electronics applications below 650V that require a cost-effective solution without any compromise on the reliability and performance of the device. Nexperia has developed a new rectifier technology based on silicon germanium (SiGe) for applications in the 100-200V range. In this talk the static and dynamic behavior of the novel SiGe rectifier are discussed and compared to other technologies including the thermal stability and switching behavior of SiGe rectifiers.
(PC5) Broadcom Isolation Solutions to Drive and Sense IGBT Modules
Tee Chun Keong, Product Manager, Broadcom
The presentation will showcase Broadcom isolation solutions to drive and sense Infineon and Fuji Electric, 1200V EconoDUAL and Dual XT IGBT modules. It will demonstrate how the smart gate drive optocoupler, ACPL-339J is used to scale gate drive design for these IGBTs from 225A to 1000A. We will also discuss how ACPL-C87B isolated voltage sensors are used to measure the DC Bus voltage and sense the temperature of the IGBT module. And lastly, how the ACPL-736J, a 50mV isolated Sigma-Delta modulator is used together with a shunt resistor to measure up 1000A of load current.
(PC6) New Gate Drivers optimized for Mitsubishi Electric IGBT Module LV100 series parallel operation
Wolfgang Rath, Sales Manager, Tamura
Tamura will outline their Gate Driver Module Solutions for the Mitsubishi Electric New Package / LV100 for single and parallel operation.
(PC7) New GaN-Based IC and Power Architecture Reduces Volume of AC-DC Converters by Up to 40%
Mike Matthews, Vice President of Product Development, Power Integrations
The ubiquity of rapid charge technology and the performance benefits delivered by wide-bandgap switches have created a step change in power supply size and performance. Consumers are engaged and tiny form factors are now expected. Power Integrations will announce the release of MinE-CAP™ IC, which reduces power supply form factor and increases peak power. Employing PowiGaN™ switch technology the new IC enables a reduction of up to 50% in the size of bulk capacitors without increasing output ripple. The new device is ideal for space constrained applications such as chargers, appliances and wall outlets, and reduces the need for high voltage capacitors to support ultra-wide range power supplies for regions with unstable mains voltages.
(PC8) New ASIC Sensors optimized for SiC and renewable energy applications
Wolfgang Rath, Sales Manager, Tamura
Tamura will introduce a new current sensor series for industrial and renewable energy market. The new series is be optimized for higher bandwidth range of SiC application based on ASIC technology.
(PC9) Achieving optimal performance: Minimizing EMI and switching loss for SiC FETs
Peter Losee, Director of Technology Development, UnitedSiC
UnitedSiC FETs are yielding breakthrough performance in hard switching and soft-switching power converters. In this presentation, we’ll discuss how to get the most performance out of SiC devices while still meeting the EMI and overshoot limitations considered by most designers.
(PC10) Next Generation High Voltage Discrete Power Products for Automotive Applications
Wibawa Chou, Head of Automotive High Power Application and Innovation Engineering, Infineon Technologies
The proliferation of electrified vehicles have pushed the boundaries of power semiconductor performance to the next level. Silicon power devices have traditionally been used to control various power electronic systems in a car such as for main inverter motors, pumps, HVAC compressors, braking and steering systems. Recent advancement of compound semiconductor device such as Silicon Carbide (SiC) has enable increase efficiency of most systems in a vehicle. Infineon is presenting SiC technology as the next generation high voltage discrete products for automotive OBC applications.
(PC11) Transforming the semiconductor market post-COVID using digital tools and big data to break barriers
Jens Gamperl, CEO Sourceability
This talk would explore how sourcing for the semiconductor sector is opening up from traditional markets (China), how this has been accelerated by the challenges of COVID-19, and the way digitalization of the supply chain will facilitate this evolution.
(PM1) Keynote: Redefining Power Conversion with GaN Integrated Circuits
Alex Lidow, Ph.D., CEO at EPC
Discrete power transistors, whether silicon-based or GaN-on-silicon, are entering their final chapter. GaN-on-Si integrated circuits offer higher performance in a smaller footprint with significantly reduced cost and less engineering required. This keynote details how the ascent of GaN integration is redefining power conversion much like Si integration redefined digital and analog signal processing five decades ago.
(PM2) Parallel multiple MOSFETs using optimized current sharing technology
Stein Nesbakk, Application Engineer at Nexperia
In High Power Applications, such as Motor Control, one MOSFET may not be enough – hence paralleling MOSFETs becomes a necessary solution. To achieve a reliable design that shares and stresses the devices equally, it is common to request semiconductor manufacturers to provide parts with matched threshold voltages. However, even with very tightly controlled production facilities there is an inevitable spread in the threshold voltage across the wafer. Any effort to provide matched Vth will require special screening and sorting that can result in yield loss, thus affecting the cost of the devices supplied. Nexperia have developed a new and unique MOSFET with improved current sharing capability when used in parallel which no longer relies on matched threshold voltages.
(PM3) The 48 V Revolution: GaN for High Density Computing and Ultra-thin Laptops?
Alex Lidow, Ph.D., CEO at EPC
This presentation will show how GaN-based solutions increase efficiency, shrink the size, and reduce system costs for high density computing applications and ultra-thin laptops. There is a fundamental shift in server architecture enabled by GaN which reduces energy losses by greater than 30%. The presentation will cover the various topologies for 48 V power in data centers including buck, LLC, and switched cap and the pros and cons of each. Lastly, how GaN helps to meet the demanding requirements of high power in small form factors for ultra-thin laptops and high-end gaming systems will be discussed.
(PM4) Fast Charging with USB Type-C and Power Delivery
Sagar Khare, Executive Business Manager at Maxim Integrated
The convenience of a smaller, reversible connector makes USB-C attractive for charging and powering portable devices, including those that traditionally used AC-DC barrel adapters. Advanced features like 5G and 4k displays in portable devices are driving up power consumption over 15W, and higher battery capacities are needed to support longer runtimes. For these gadgets, USB Power Delivery (PD) enables fast charging that gets these products back in operation with little downtime. For designers, however, compliance with the USB-C and USB PD standard typically requires complex firmware development and additional hardware components. The presentation examines how USB-C chargers and out-of-the-box compliant, standalone USB PD controllers reduce development time by eliminating complex firmware and minimize the solution size through greater integration and high performance.
(PM5) Benefits and drawbacks of the most common power management techniques
Wilfried Dron, CEO at Wisebatt
For battery-powered application, a long battery life is most of the time a key requirement. IoT devices are often enhanced with extra innovative features implying higher power consumption, which turns the battery life target into a real challenge. Yet this parameter is essential to meet market expectations and achieve long-lasting and reliable performances. The methods to optimize a device's power consumption need to be explored right at the beginning of its design phase. In this technical presentation, Wilfried Dron, CEO at Wisebatt, reviews 5 of the most known techniques of power optimization with their practical illustrations, advantages and drawbacks.
(PM6) Optimizing your next power system by using an effective design tool
Bob Cantrell, Senior Field Application Engineer and Phil Goff, Regional Sales and Marketing, Flex Power Module
Flex Power Designer software moves beyond converter configuration and provides an overview of the whole power system enabling you to define relationships across rails—phase spreading, sequencing, and fault spreading. The latest update includes a highly anticipated reference design tool for Xilinx-based field-programmable gate arrays (FPGAs). It also provides further system optimization and loop compensator features to improve overall power-stage design analysis, helping power designers to accelerate time to market. We're hoping to demonstrate the freely available tool which allows the power specifications for FPGA designs to be determined more accurately and reliably. FGPAs are designed early in the product’s design cycle, often even before the logic within FPGA has been designed. An accurate worst-case power analysis at this stage will help you avoid the pitfalls of overdesigning or under-designing the product’s power system.
(PM7) Using AI to increase EV range
Bruce Renouard, CEO Pre-Switch
Transistor switching losses inside an EV Inverter fundamentally affect both the inverter efficiency and the motor drive efficiency -and hence EV range. Optimum EV motor efficiency is achieved with a pure sine wave output from the inverter. Unfortunately, due to transistor switching losses, the faster switching frequencies needed to achieve the pure sine wave output actually reduce inverter efficiencies. Pre-Switch’s embedded AI virtually eliminates switching losses thus solving both efficiency challenges. Inverter efficiencies are improved despite using 10X higher switching frequencies. The new higher switching frequencies reduce sine wave distortion and improve motor efficiency. Further, the reduction of switching losses also reduces the size and cost of the SiC transistors in the inverter. Best of all, EV range is increases – by a substantial 5-12%. Using real data obtained from Pre-Switch’s CleanWave 200kVA inverter reference, this discussion will show how system level inverter efficiencies of over 99% can be achieved with a switching frequency of 100kHz.
(PS1) Keynote – Now Playing: Power Supplies Set the Stage for Future Tech Advancements
Sherrie Clark, Chief Technology Officer at ABB Power Conversion
From flying cars to teleportation, 20th century television and cinema set high expectations for the kind of advanced technology that would power our world in 2020 and beyond. While present day certainly doesn’t resemble the Jetsons, nor will anyone be headed Back to the Future anytime soon, technology is in fact on the cusp of delivering innovations that we first imagined years ago like autonomous vehicles and industrial robotics. From smart cities and digital health technology to supply chain optimization and lights-out operations, the innovations of the next decade will solve many of the complex challenges currently impacting the way we work and live. For such important innovations to flourish, however, there is one essential and unifying need – reliable, compact and efficient power supply systems. During this keynote presentation, Sherrie Clark, chief technology officer of ABB’s Power Conversion division, will explore the role that power supplies are already playing in support of the mission-critical innovations of the future. By the end of her presentation, the audience will gain a better understanding of the industry trends that are perpetuating the demand for more power, and as a result, more innovative power supplies.
(PS2) Frequency Response Analysis
Gilles Clermont, Application Engineer at Tektronix
During this presentation we will cover the basics about Frequency Response Analysis, Control Loop Response and Power Supply Rejection Ratio, the importance of them to power supply design engineers and why an oscilloscope is an ideal solution for these critical measurements.
(PS3) Testing! Not Guessing!
Thomas Rottach, Sales & Marketing Manager, Siglent Technology Germany
The growing demand for electrical power generated a renaissance of Power Electronics. Modern converters are required to be highly efficient, reliable and compliant. Testing, already during the development phase helps to reach the design target goal and avoid surprises in later stages. This presentation will give an overview on the challenges and show selected T&M solutions.
(PS4) Technologies for Hardware In the Loop Simulation of Complex Power Converter
Niklaus Felderer, Team Leader Applications Engineering at Plexim
Power electronic converters with complex topologies are typically found in high-power applications such as renewable energy generation, medium voltage motor drive and DC flexible power transmission. Neutral point clamped converter (NPC), modular multi-level converter (MMC), cascaded H-bridge converter (CHB) are typical examples. Besides that, parallel or series connections of such base topologies are also commonly used. The large amount of switching devices in modular converters increases the complexity of the control system significantly. In order to validate the controller performance without the risk of breaking or needing a prototype, hardware-in-the-loop (HIL) simulations can be used. This presentation introduces specific technologies for the modeling of complex power converters in HIL simulations, regarding accuracy and computational effort.
(PS5) GaN and SiP approaches are making power supplies more efficient and smaller
Gabriele Gherdovich, Segment marketing manager, Industrial & Power Conversion Division at STMicroelectronics
Greater efficiency and smaller size have been continuous goals of the semiconductor industry since its inception and the effort continues, now, with moves into compound semiconductors that offer a new path and a big step.
(PS6) Don’t Get Interrupted! Tips for Ensuring Robust Uninterruptible Power Supply Design
Todd Phillips, Global Strategic Marketing Manager for the Electronics Business Unit, Littelfuse
Data centers are mission critical to the world’s business. Uninterruptible power supplies (UPS) are essential instruments that assure zero downtime and keep data centers operational in the event of a power failure. Their importance demands that all UPS devices be highly reliable to avoid the overloads and transient surges that can occur on an AC line. To ensure your UPS design is robust, this presentation provides helpful design recommendations for:
• Circuit protection from potentially damaging overload conditions
• High-efficiency control components for reduced power consumption
• Temperature sensing for active component protection
Also learn about the global standards with which your UPS design must comply and avoid costly repeat certification testing that delays getting your product to market. These recommendations ensure you will have a safe, robust, efficient, and compliant design that reliably supports your customers’ data centers.
(PS7) 2020 – a challenging year full of opportunities for power designers
Patrick Le Fevre, Chief Marketing and Communication Officer, POWERBOX
The worldwide lockdown and stay-at-home policies changed the way power designers used to work and, if it is for sure hard to manage bench test at home, Cloud based application e.g. simulation and verification tools opened new way-of-working for many. COVID19 has also been an opportunity to accelerate new technologies investigations and implementations. However, if WBG (GaN, SiC) is in everybody's mind the step from marketing buzz to implementation a real challenge for many. New technologies adoption has always been a long and complex process and it is interesting to analyze previous technologies adoption cycles and what could be the COVID19 impact on it.
(ES1) Keynote: Enabling the world of Unlimited Energy through semiconductor based Energy storage solutions
Dr. Raghavan Nagarajan, Principal Engineer – High Power Technical Marketing, Infineon Technologies
Energy storage is not a new concept in itself. It has been an integral component of electricity generation, transmission, distribution as well as consumption for well over many decades. Now the power landscape is changing dramatically with growing renewable energy generation. However, this shift to renewable sources also makes delivering power reliably, where and when it is necessary is a big challenge than ever before. In this presentation, the various option of introduction of ESS in real grid network along with general architecture of ESS and its major blocks will be discussed. In addition to the above, classification of ESS and some of the key drivers of the ESS will be illustrated before moving on to discuss various storage technologies and importance of Battery Management Systems (BMS). Finally, summary of the entire Energy storage system landscape and Infineon product portfolio offerings for Energy storage system will be presented.
(ES2) SiC enabling long term global market growth
Guy Moxey, Senior Director of Power Products at Wolfspeed
It is widely realized that SiC is now an established technology that is transforming the power industry in many applications across the industrial, energy and automotive segments - from watts to megawatts. So the conversations within the market are no longer what is SiC or how do I use it?; the conversations now have pivoted to how do I ensure getting continuity of supply and what is the long term reliability of this technology. Reliability is not just qualification, supply assurance is not just product today so in this conference session wolfspeed will discuss the mechanisms behind its SiC qualification, realization of differences between Sic and silicon with regards to qual & rel, its compressive proven long term reliability and how this related to a 30X increase in both material and end wafer fabrication over the next series of years.
(ES3) Economics and the Challenge of Renewable Energy Storage – A Small Change that Can Revolutionize the Industry
Paul Wiener, Vice President Strategic Marketing, GaN Systems
With increasing interest in renewable energy from both businesses and consumers, the industry is faced with design challenges around critical energy storage systems (ESS.) Without storage, energy cannot be distributed on demand. The engineering design of today’s solutions must evolve to produce products that are simpler, more efficient, and smaller in size. The greater durability, reliability, and decrease in watts lost in conversion presents an opportunity to revolutionize this industry – and even have a transformative impact on the world. This session will go into detail about how Gallium Nitride (GaN) power transistors will play a central role in this revolution by enabling the creation of smaller, lighter, lower cost, and more efficient power systems that are free from the limitations imposed by yesterday’s silicon-based solutions. During this session, attendees will learn and understand:
- The details of how GaN technology is being used in renewable energy storage and other markets such as industrial aerospace, data centers, automotive and consumer electronics.
- The ROI of GaN technology - the maturity of the technology and the benefits that go beyond just the bill of material. This will be discussed through real life examples with data to support.
- The maturity of the GaN technology market at this point in time.
(ES4) SiC-Based Vienna PFC Power Stage Modeling and Simulation
Ehab Tarmoom, Applications Engineer, Discrete & Power Management, Microchip
This webinar focuses on the modeling and simulation of Microchip’s SiC-based 30 kW Vienna PFC reference design using PLECS® simulation software. The PLECS® model, available for download at www.microchip.com/SiC, enables users to evaluate, analyze, and tune the 30 kW Vienna PFC Reference Design in a multi-domain, behavioral simulation environment. Power electronics engineers can evaluate power factor, switching losses, efficiency, and junction temperatures while controls engineers evaluate stability using the controller model provided or with the embedded software via Processor-In-the-Loop (PIL).
(ES5) Supercap to the Rescue: Choosing the Right Supercapacitor for Your Application
Roya Nikjoo, Field Application Engineer, KEMET
Supercapacitors with very high capacitance values and low voltages are the bridge between the capacitors and the batteries. They are mainly used as back-up devices for the power shut-down of microcomputers and RAMs, smart meters, POE network devices, alarm systems, etc. In this presentation, KEMET’s Roya Nikjoo (Field Application Engineer, Europe Nordic) explains which parameters need to be defined before choosing the right supercapacitor for your application.